A three dimensional integrated circuit is composed of multiple tiers of integrated electronics and sensors integrated vertically by wafer bonding, thinning and insertion of through-silicon-vias. The technologies associated with three dimensional integrated circuits can provide new capabilities for high energy physics and x-ray imaging experiments. These include finer pixel pitch, lower interconnect capacitance, the ability to separate analog and digital functions, and better power distribution

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... nd connectivity. In this paper we review the status of 3DIC demonstration projects at Fermilab, discuss several possible applications, and summarize the current availability of commercial processes. Results of a three-tier demonstration project that includes designs for x-ray imaging, CMS track triggering, and ILC vertex are described. We discuss the status of several ongoing 3D projects and prospects for future evolution of the technology.