Study on Toughening Mechanism of Epoxy Adhesive Modified by Nano-SiO2

2013 Asian Journal of Chemistry  
Epoxy resin is one of the important type of thermosetting resins, which has a wide range of excellent physical and chemical properties, essential for the current technologies and for the development of new technologies, such as increased chemical activity and physical properties 1,2 . In many industries, epoxybased adhesives are employed extensively to bond different substrate materials because of their strong adhesion to various treated or untreated metal surfaces [3] [4] [5] . Polymer
more » ... e materials are the most widely used matrix resin. Epoxy resin possesses excellent adhesion, wear resistance, mechanical properties, electrical insulation, chemical stability, resistance to high and low temperature, as well low shrinkage. Nanocomposites, with high stiffness and dimensional stabilities can also be used as flame retardant materials [6] [7] [8] . EXPERIMENTAL The main laboratory reagents in the present study are the following: Epoxy resin E-44 (DGEBPA), nano-SiO2 [Style: SS1, spherical particles, particle size (30 ± 5) nm, specific surface area (160 ± 20) m 2 /g, bulk density 0.11 g/cm 3 , w(hydroxy) = 19 %, UV reflectivity 75 %] and MeTHPA. A certain percentage of dispersant nano-SiO2 mixed with the melt mixed, was added to the suspension and stirred. The temperature increase is lower than that solvent mixing. The epoxy adhesive continued to strengthen and stabilized the dispersion of nano-particles after 0.5 h of heating to a higher temperature and then cooled to room temperature after dispersion by the emulsifying machine. As the nano-SiO2
doi:10.14233/ajchem.2013.14121 fatcat:qdejrpgkazferjmtappxp6wyoy