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Session 25 overview: High-bandwidth low-power DRAM and I/O: Memory subcommittee
2014
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)
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Requirements for high bandwidth and low power continue to increase in servers and consumer electronics. There are significant challenges in DRAMs to meet all such needs in various applications. In ISSCC 2014, the first LPDDR4 DRAM for mobile applications is demonstrated which has an integrated ECC engine for low-power operation. Next, the first High-Bandwidth Memory (HBM) with 4 TSV stacked layers achieving 128GB/s bandwidth is disclosed. Also, new circuits to reduce standby and I/O power in
doi:10.1109/isscc.2014.6757571
fatcat:tca2yk6qifdlrpuzvxtz4zbmgu