遷移的液相焼結法(TLPS)によるSiCパワーデバイスの高温接合技術
High Temperature Resistant Joint Technology for SiC Power Devices Using Transient Liquid Phase Sintering Process

Fengqun Lang, Hiroshi Yamaguchi, hiroshi Nakagawa, Hiroshi Sato
2012
doi:10.11486/ejisso.26.0_295 fatcat:meea4vgb6bezfgwywbmvwdfsga