Manufacturing Cost Optimization of Ultrasonic Horn for Flip-chip Bonding using Tolerance Design
공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화

Jong-Hyok Kim, Won-Tae Kwon, Soo-Il Lee
2012 Journal of the Korean Society for Precision Engineering  
The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and
more » ... uracy is necessary. In this research, an attempt was made to design the ultra sonic horn within acceptable natural frequency while the manufacturing cost was kept as low as possible. For this purpose, among the 18 tolerances of physical terms of the ultrasonic horn, the most important 4 factors were selected using Taguchi method. The equation to relate those main factors and the natural frequency was made using response surface method. Finally, optimal design scheme for minimum manufacturing cost without a loss of performance was determined using SQP method.
doi:10.7736/kspe.2012.29.8.879 fatcat:umqtpljferhm7l3iczj4qjgjme