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Manufacturing Cost Optimization of Ultrasonic Horn for Flip-chip Bonding using Tolerance Design
공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화
2012
Journal of the Korean Society for Precision Engineering
공차설계에 의한 플립칩 접합용 초음파 혼의 제작 비용 최적화
The ultrasonic horn used for bonding of flip chip has been designed to vibrate at a natural frequency. The ultrasonic horn must be manufactured accurately in physical terms, because the small change of mechanical properties may result in the significant change of natural frequency. Therefore, tight tolerance is inevitable to keep the natural frequency in acceptable range. However, since tightening of the tolerance increases the manufacturing cost significantly, trade-off between the cost and
doi:10.7736/kspe.2012.29.8.879
fatcat:umqtpljferhm7l3iczj4qjgjme