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We have systematically investigated the influence of different bonding parameters on void formation in a low-temperature adhesive bonding process. As a result of these studies we present guidelines for void free adhesive bonding of 10 cm diameter wafers. We have focused on polymer coatings with layer thicknesses between 1 µm and 18 µm. The tested polymer materials were benzocyclobutene (BCB) from Dow Chemical, a negative photoresist (ULTRA-i 300) and a positive photoresist (S1818) from Shipley,doi:10.1088/0960-1317/11/2/303 fatcat:6sxasmitsfckdjbqhp5uvp2oo4