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Fragmentation and recombination of copper dimers deposited on an Ar film
1999
Physical Review B (Condensed Matter)
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The collision between a copper dimer and an Ar film is investigated by molecular-dynamics simulations. A dimer fragmentation rate of 24% is found for an impact kinetic energy of 25 eV per atom, in agreement with previous experimental results. Temporary dissociation of the dimer followed by a reaggregation is observed in 14% of the cases. The collision induces a fast superheating of the Ar film around the impact point followed by a liquefaction. The cooling rate of the copper dimer is found to
doi:10.1103/physrevb.60.11730
fatcat:6vtnl7qz3vgohebi7j34skrul4