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A measurement method for characterizing the substrate noise over the ultra-wideband (UWB) frequency band in UWB systems implemented using lightly doped CMOS processes is presented. The measurement structure in this method is based on modified ground-signal-ground (GSG) pads. In addition, the effects of the distance-based substrate resistance and the capacitive coupling between the substrate and the ground of the measurement setup are evaluated by on-wafer measurement of a test chip fabricateddoi:10.1109/norchp.2007.4481057 fatcat:qv3scahksrfmfgytqm2g7bqbxe