The Influence of the Wire Arrangement on the Wire Sweep of Plastic IC Encapsulation

Tsumoru TAKADO, Hiroshi ARITA, Takuya MIYAMOTO, Yasuhide OHNO
2002 Journal of The Japan Institute of Electronics Packaging  
Semiconductor package has been become more complex structure, including wiring technique. And, matter of wire sweep due to resin flow in encapsulation begins to be more complicated again. It first the distribution of wire sweep in QFP was investigated. Then, it was examined fundamentally about some kinds of influence on encapsulation conditions. And, computer simulation was done about that result. Furthermore, we studied on pressure inside cavity for the wire sweep.
doi:10.5104/jiep.5.64 fatcat:kibpd62y3vd4dan7wuczrhoepq