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Journal of The Japan Institute of Electronics Packaging
Semiconductor package has been become more complex structure, including wiring technique. And, matter of wire sweep due to resin flow in encapsulation begins to be more complicated again. It first the distribution of wire sweep in QFP was investigated. Then, it was examined fundamentally about some kinds of influence on encapsulation conditions. And, computer simulation was done about that result. Furthermore, we studied on pressure inside cavity for the wire sweep.doi:10.5104/jiep.5.64 fatcat:kibpd62y3vd4dan7wuczrhoepq