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Instabilities of Thin Films on a Compliant Substrate: Direct Numerical Simulations from Surface Wrinkling to Global Buckling
2020
Scientific Reports
For structures consisting of a thin film bonded to a compliant substrate, wrinkling of the thin film is commonly observed as a result of mechanical instability. Although this surface undulation may be an undesirable feature, the development of new functional devices has begun to take advantage of wrinkled surfaces. The wrinkled structure also serves to improve mechanical resilience of flexible devices by suppressing crack formation upon stretching and bending. If the substrate has a reduced
doi:10.1038/s41598-020-62600-z
pmid:32235886
fatcat:ripwajavlfagtknyolz72bl2bi