A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is application/pdf
.
Microelectronics packaging technology roadmaps, assembly reliability, and prognostics
2016
Facta universitatis - series Electronics and Energetics
This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by
doi:10.2298/fuee1604543g
fatcat:3azhhqsxufa7vbzdh5twk557xi