Influence of Al addition on thermal parameters, microstructure and hardness of a Sn-Cu eutectic alloy

Lucas Inacio dos Santos, Noe Cheung, Thiago Soares Lima
2017 XXV Congresso de Iniciação Científica da Unicamp   unpublished
The present work investigated the microstructure evolution as well as the mechanical property (Vickers microhardness) of Sn-0.7%Cu alloy samples (with and without the addition of 0.1%Al) obtained by unsteady-state solidification. The use of a water-cooled solidification device permitted to encompass the cooling conditions found in real welding situations. An experimental approach to determine quantitatively the thermal parameters such as growth and cooling rates was carried out. Metallographic
more » ... nvestigations of solidification microstructures were performed and the microstructural spacing were correlated with the thermal parameters and, with the mechanical property of Vickers microhardness.
doi:10.19146/pibic-2017-78539 fatcat:feapjkfsuzaefgy4otnyed2yvi