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International Engineering Research Journal (IERJ) Special Issue
In recent years, electrical equipment are drastically developing and miniaturizing. Higher integration of semiconductor devices leads to these developments. On the other hand, higher integration of semiconductor devices on one chip and higher integration of electrical devices in one package means increase of heat generation density. The operation of integrated circuits (IC) at elevated temperature is a major cause of failures in electronic devices and a critical problem in developing morefatcat:wvmxshssibe7zlpvek23xxb4ym