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This research aims at characterizing and predicting the Young's Modulus of thin film materials that are utilized in the Microelectromechanical systems (MEMS). As a proof of concept, aluminum and TEOS thin films were analyzed using bilayer cantilever as a test structure. Due to the lack of understanding of the mechanical behavior of thin film materials in the micro-scale domain, empirical models were developed that utilize soft computing techniques. As a result, this methodology is foreseen to