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東出 政信, 仁科 健, 川村 大伸. "3-1 半導体製造工程において有効なSPCへの挑戦(セッション3「試験、故障解析、部品、要素技術の信頼性、ハードウェア面、管理手法適用事例」)." Proceeding of Symposium on Reliability 2010Spring.18.0 (2010) 49-52