A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2009; you can also visit the original URL.
The file type is application/pdf.
Chip-package co-design of common emitter LNA in system-on-package with on-chip versus off-chip passive component analysis
2003
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)
Preserved Fulltext
In this paper, we present common emitter LNAs (low noise amplifiers) in system-on-package for 5GHz WLAN application. Innovation of this module is that it is chip-package co-designed and co-simulated with performance trade-offs for on-chip versus offchip passive component integration. It thus provides an optimal total solution for embedded RF electronics in system-level integration. Analytical equations for key performance parameters, noise figure and gain, of these LNAs are developed as
doi:10.1109/epep.2003.1249999
fatcat:yjhn2j6pbnen7o3txd52i5x3gu