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High Adhesion Plating on Smooth Resin Surfaces Using a High-power UV Lamp
2017
Transactions of The Japan Institute of Electronics Packaging
The increasing sophistication of information in society and the impending 'Internet of Things' will require smaller and higher-performance electronic devices, and faster also signal transmission, Particularly printed circuit board materials, such as cyclo-olefin polymers (COP) and liquid-crystal polymers (LCP), have been drawn attention for their low dielectric properties. Circuitry formation on these materials need plating treatment. Plating techniques on surface-modification using UV
doi:10.5104/jiepeng.10.e16-018-1
fatcat:mnv2hsl4cjb4hfooms6s4vzm5e