Metallization of alumina ceramics by electroless-plating
アルミナセラミックスの無電解めっきによるメタライゼーション

Tetsuya OSAKA, Kazuhisa NAITO, Yukihiro YAMIYA, Kaori SAKAGUCHI
1989 Circuit Technology  
To clarify the adhesion mechanism between alumina substrates and
doi:10.5104/jiep1986.4.285 fatcat:aqieeqtjlzduxcnk7zzlzzwnie