A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2019; you can also visit the original URL.
The file type is
Amorphous metallic films have been considered to be the most effective barriers layer for Cu metallization due to the absence of grain boundaries and immiscibility with copper. The time and cost required for nano-scale experimant may be exceedingly large, and for this reason molecular dynamics have been used to analyze the material properties of CuAg amorphous metal films in this study, including the glass transition process of amorphous metal films, the effect of composition ratio anddoi:10.12783/dtcse/cmsam2018/26547 fatcat:5l7o43v6hzb5xcz3tevag5si6y