ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

Roman Koleňák, Michal Prach, Igor Kostolný
2016 Acta Polytechnica  
This work deals with the effect of solder alloying with a small amount of lanthanum on joint formation with metallic and ceramic substrate. The Bi-Ag – based solder with 2 wt.% lanthanum addition and Bi solder with 2 wt.% lanthanum addition were studied. Soldering was performed by a<br />fluxless process on the air, by activation with a power ultrasound. It was found out that, during the process of ultrasonic soldering, lanthanum is distributed on the boundary, both with the copper and the
more » ... copper and the ceramic substrate, which enhances the joint formation. The bond with Al<sub>2</sub>O<sub>3 </sub>ceramics is of an adhesive character, without the formation of a new contact interlayer.
doi:10.14311/ap.2016.56.0126 fatcat:ksmhk6znm5dvfdyprv4vgfzype