Analysis of Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Film during Moisture/Reflow Sensitivity Test

Won-Keun KIM, Toru IKEDA, Noriyuki MIYAZAKI
2005 Journal of The Japan Institute of Electronics Packaging  
Anisotropic conductive adhesive film (ACF) has been used for electronic assemblies such as the connection between a liquid crystal display (LCD) panel and a flexible printed circuit board (FPC) . Recently, ACF is expected to be a key technology in flip-chip and system-in-package (SiP) packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using ACF. The stress intensity
more » ... ctors of an interface crack between jointed dissimilar materials were utilized for the evaluation of the delamination occurring in a flip chip connected with ACF under moisture/reflow sensitivity tests.
doi:10.5104/jiep.8.215 fatcat:ghkehclzbbguhoazkbe2uxyvqe