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Analysis of Delamination in a Flip Chip Using Anisotropic Conductive Adhesive Film during Moisture/Reflow Sensitivity Test
異方性導電樹脂接合型フリップチップの吸湿リフロー試験時のはく離予測解析
2005
Journal of The Japan Institute of Electronics Packaging
異方性導電樹脂接合型フリップチップの吸湿リフロー試験時のはく離予測解析
Preserved Fulltext
Anisotropic conductive adhesive film (ACF) has been used for electronic assemblies such as the connection between a liquid crystal display (LCD) panel and a flexible printed circuit board (FPC) . Recently, ACF is expected to be a key technology in flip-chip and system-in-package (SiP) packaging. The goal of our work is to provide an optimum design scheme to achieve the best combination of electrical performance and mechanical reliability for electronic packages using ACF. The stress intensity
doi:10.5104/jiep.8.215
fatcat:ghkehclzbbguhoazkbe2uxyvqe