Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

Zhaoxia Zhou, Li Liu, Changqing Liu
2018 2018 7th Electronic System-Integration Technology Conference (ESTC)  
The present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during heating. In addition, stress building up was evidenced by the progressive evolving of the dislocations at the interface between Ni-W-P interlayer and the ZnAl Solder. However, due to the µm to nm scale
more » ... the µm to nm scale of specimens' dimensions required for electron microscopy, the sample preparation and data interpretation remains a challenge.
doi:10.1109/estc.2018.8546440 fatcat:hpygqra7kjanhdwcnjblqa46wq