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Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation
2009
IEEE Journal of Selected Topics in Quantum Electronics
Preserved Fulltext
A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors
doi:10.1109/jstqe.2009.2018478
fatcat:ceaip7yazvdm7kfswo6jzv2qbq