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Crystal Orientation Mapping of Copper Interconnects using EBSD
2000
Microscopy Today
The semiconductor industry is committed to introducing copper interconnects in place of aluminum for the latest generation of semiconductor devices. With its greater current carrying capacity, the use of copper should enable further reductions in device geometry, power consumption and heat generation, and lead to higher performance and longer battery life in portable devices.Grain orientations, crystal log raphic 'texture' trends and boundary types are crucial in determining properties such as
doi:10.1017/s1551929500052834
fatcat:o52xcqqmzfcmpous7su7d36vaa