<span title="">2021</span> <i title="IEEE"> 2021 IEEE International 3D Systems Integration Conference (3DIC) </i> &nbsp;
Machine learning, deep learning, autonomous driving, and other artificial intelligence applications are driving the performance requirements of next generation computing hardware. To meet the increasing demand for large-scale data analysis, data centers need low latency and significant memory bandwidth, combined with lower power consumption. In order to manage costs and deliver high performance products to the market, designers are integrating high bandwidth memory (HBM) stacks with high
more &raquo; ... ance logic die to address this need in 2.5 and 3D integration. Examples include AMD-Radeon Vega Frontier, and Nvidia-A100 Ampere. Nevertheless, the interconnect density limitations remain an
<span class="external-identifiers"> <a target="_blank" rel="external noopener noreferrer" href="">doi:10.1109/3dic52383.2021.9687605</a> <a target="_blank" rel="external noopener" href="">fatcat:m27oybj3brhilb2m6bkb76k5ia</a> </span>
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