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640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection
IEEE Transactions on Advanced Packaging
A 640-Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25-m CMOS, and optical wavelength-division-multiplexing (WDM) interconnection is fabricated for future broadband services. A 40-layer, 160 114 mm ceramic MCM forms the basic ATM switch module with 80-Gb/s throughput. It consists of an 8 advanced 0.25-m CMOS LSIs and 32 I/O bipolar LSIs. The MCM has a 7-layer high-speed signal line structure having 50-strip lines, high-speed signal lines, and 33doi:10.1109/tadvp.2002.1017687 fatcat:j7kacwbpqjcexidboozs2lniqa