Internet Archive Scholar

Layout parameter optimization based power and signal integrity performance improvement of high-speed interfaces of wirebond packages

Om P. Mandhana, Jin Zhao
2013 2013 IEEE 63rd Electronic Components and Technology Conference  

Preserved Fulltext

fulltext thumbnail
Web Archive Capture PDF (1.1 MB)
https://web.archive.org/web/20180714011117/http://www.oldfriend.url.tw:80/article/IEEE_paper/PI/2013_Layout%20Parameter%20Optimization%20Based%20Power%20and%20Signal%20Integrity%20Performance.pdf

A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL. The file type is application/pdf.

The purpose of this paper is to present layout parameter optimization based power and signal integrity performance improvement investigation of high-speed interfaces in wirebond packages. Effects of different sections of signal nets, wirebond diameter, material and other stackup parameters on the noise performance of the package system is discussed in detail. The methodology developed in this paper, based on different sections of power and signal nets and supported by simulation results,
more » ... s design guidelines for the efficient and cost-effective wirebond IC-package systems development.
doi:10.1109/ectc.2013.6575871 fatcat:6dmd6rwm3jcdviicwiymofhedy
Citation

Om P. Mandhana, Jin Zhao. "Layout parameter optimization based power and signal integrity performance improvement of high-speed interfaces of wirebond packages." 2013 IEEE 63rd Electronic Components and Technology Conference (2013)