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Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic
Au合金バンプ/Alパッド超音波接合信頼性と接合界面組織
2014
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Au合金バンプ/Alパッド超音波接合信頼性と接合界面組織
Preserved Fulltext
Al 0.8 1.0 1.2 m Al 1.2 m 5) 99.99%Au Pd
doi:10.2207/qjjws.32.57
fatcat:qne34lowxndqzpolw6kk3kzpra