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Robust and resilient designs from the bottom-up: Technology, CAD, circuit, and system issues
2012
17th Asia and South Pacific Design Automation Conference
The semiconductor industry is facing a critical research challenge: design future high performance and energy efficient systems while satisfying historical standards for reliability and lower costs. The primary cause of this challenge is device and circuit parameter variability, which results from the manufacturing process and system operation. As technology scales, the adverse impact of these variations on system-level metrics increases. In this paper, we describe an interdisciplinary effort
doi:10.1109/aspdac.2012.6165064
dblp:conf/aspdac/ReddiPNB12
fatcat:khckyzmudvc6xfx2lgclvhioke