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REBEL and TDC: Two embedded test structures for on-chip measurements of within-die path delay variations
2011
2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
As feature printability becomes more challenging in advanced technology nodes, measuring and characterizing process variation effects on delay and power is becoming increasingly important. In this paper, we present two embedded test structures (ETS) for carrying out path delay measurement in actual product designs. Of the two structures proposed here, one is designed to be incorporated into a customer's scan structures, augmenting selected functional units with the ability to perform accurate
doi:10.1109/iccad.2011.6105322
dblp:conf/iccad/LamechAPRA11
fatcat:lc3eb4jftbbkbafxaoe6qd27da