Reconfiguration Process Optimization of Dynamically Coarse Grain Reconfigurable Architecture for Multimedia Applications

Bo LIU, Peng CAO, Min ZHU, Jun YANG, Leibo LIU, Shaojun WEI, Longxing SHI
2012 IEICE transactions on information and systems  
This paper presents a novel architecture design to optimize the reconfiguration process of a coarse-grained reconfigurable architecture (CGRA) called Reconfigurable Multimedia System II (REMUS-II). In REMUS-II, the tasks in multi-media applications are divided into two parts: computing-intensive tasks and control-intensive tasks. Two Reconfigurable Processor Units (RPUs) for accelerating computing-intensive tasks and a Micro-Processor Unit (µPU) for accelerating control-intensive tasks are
more » ... ined in REMUS-II. As a large-scale CGRA, REMUS-II can provide satisfying solutions in terms of both efficiency and flexibility. This feature makes REMUS-II well-suited for video processing, where higher flexibility requirements are posed and a lot of computation tasks are involved. To meet the high requirement of the dynamic reconfiguration performance for multimedia applications, the reconfiguration architecture of REMUS-II should be well designed. To optimize the reconfiguration architecture of REMUS-II, a hierarchical configuration storage structure and a 3-stage reconfiguration processing structure are proposed. Furthermore, several optimization methods for configuration reusing are also introduced, to further improve the performance of reconfiguration process. The optimization methods include two aspects: the multi-target reconfiguration method and the configuration caching strategies. Experimental results showed that, with the reconfiguration architecture proposed, the performance of reconfiguration process will be improved by 4 times. Based on RTL simulation, REMUS-II can support the 1080p@32 fps of H.264 HiP@Level4 and 1080p@40 fps High-level MPEG-2 stream decoding at the clock frequency of 200 MHz. The proposed REMUS-II system has been implemented on a TSMC 65 nm process. The die size is 23.7 mm 2 and the estimated on-chip dynamic power is 620 mW.
doi:10.1587/transinf.e95.d.1858 fatcat:md4rzrvnsvf37f5r6duuy2gb64