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Three-dimensional wafer scale integration for ultra-large-scale cognitive systems
2017
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
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In this paper, we present a method to use threedimensional wafer scale integration (3D-WSI) to build large-scale cognitive systems up to the scale of a human brain (10 10 neurons, 10 13 synapses). We analyze the effect of scaling by simulating some cognitive systems. The result exhibits attractive properties of the 3D-WSI technology, as compared with the traditional integration scheme using printed circuit boards. At the scale of a human brain, the 3D-WSI system reduces the communication
doi:10.1109/s3s.2017.8309199
fatcat:36eqgepepjeatimtfxlislpji4