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Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress
2013
IEEE transactions on electromagnetic compatibility (Print)
This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of
doi:10.1109/temc.2013.2257796
fatcat:zgv4k5njczes3i5lze7dejus2i