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Hierarchical Thermal Management Policy for High-Performance 3D Systems With Liquid Cooling
2011
IEEE Journal on Emerging and Selected Topics in Circuits and Systems
Three-dimensional (3D) integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3D multi-processor systems-on-chips (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by means of through-silicon vias (TSVs). Because of the high power density of devices and interconnect in the 3D stack, thermal issues pose critical challenges, such as hot-spot avoidance and thermal gradient reduction. Thermal management
doi:10.1109/jetcas.2011.2158272
fatcat:pt4olh4donardmbn3a7aagshpm