vacuum to hold the chips in place. The waffle is placed on the which has 25 indentations milled in its surface for the dice and channels chips from one wafer and place them on a aluminum waffle, Checks and records offset voltages for all output The standard test procedure was as follows. We select 25 supplies voltage, with a resolution of about 6 mV. Checks and records current and voltage for all power program does the following: voltage supplies (5, 3.2, and 2.2 volts) and the threshold An HP

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... 624A power supply was used to provide three Once the probe card is lowered onto the chip, a Macintosh TEK-Z was large enough to prevent damage. high and 40 ns wide, and the output impedance seen by the