Part II: On the Three-Dimensional Filamentation and Failure Modeling of STI Type DeNMOS Device Under Various ESD Conditions

Mayank Shrivastava, Harald Gossner, Maryam Shojaei Baghini, V. Ramgopal Rao
2010 IEEE Transactions on Electron Devices  
Time evolution of self-heating and current filamentation are discussed in this paper for shallow-trench-isolation (STI)type drained-enhanced n-channel metal-oxide-semiconductor (DeNMOS) devices. A deeper insight toward regenerative n-p-n action and its impact over various phases of filamentation and the final thermal runaway is presented. A modified STI-type DeNMOS device is proposed in order to achieve an improvement (∼2×) in the failure threshold (I T 2 ) and electrostatic discharge (ESD)
more » ... ow (V T 2 ). The performance and filament behavior of the standard device under charge-device-model-like ESD conditions is also presented, which is further compared with the proposed modified device. Index Terms-Base push-out, charge device model (CDM), current filamentation, drain-enhanced metal-oxide-semiconductor (DeMOS), electrostatic discharge (ESD), human body model (HBM), input-output (I/O), kirk effect, laterally diffused metaloxide-semiconductor (LDMOS), space charge build-up, thermal runaway, transient interferometric mapping (TIM).
doi:10.1109/ted.2010.2055278 fatcat:jhxmp63crbhsbafm3nhisf6zku