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Part II: On the Three-Dimensional Filamentation and Failure Modeling of STI Type DeNMOS Device Under Various ESD Conditions
2010
IEEE Transactions on Electron Devices
Time evolution of self-heating and current filamentation are discussed in this paper for shallow-trench-isolation (STI)type drained-enhanced n-channel metal-oxide-semiconductor (DeNMOS) devices. A deeper insight toward regenerative n-p-n action and its impact over various phases of filamentation and the final thermal runaway is presented. A modified STI-type DeNMOS device is proposed in order to achieve an improvement (∼2×) in the failure threshold (I T 2 ) and electrostatic discharge (ESD)
doi:10.1109/ted.2010.2055278
fatcat:jhxmp63crbhsbafm3nhisf6zku