A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL.
The file type is application/pdf
.
Interconnect Challenges and Carbon Nanotube as Interconnect in Nano VLSI Circuits
[chapter]
2010
Carbon Nanotubes
This chapter discusses about the behavior of Carbon Nanotube (CNT) different structures which can be used as interconnect in Very Large Scale (VLSI) circuits in nanoscale regime. Also interconnect challenges in VLSI circuits which lead to use CNT as interconnect instead of Cu, is reviewed. CNTs are classified into three main types including Single-walled Carbon Nanotube (SWCNT), CNT Bundle, and Multi-walled Carbon Nanotube (MWCNT). Because of extremely high quantum resistance of a SWCNT which
doi:10.5772/39430
fatcat:hcljabun2jf53eammjxygzmk4y