A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is
Silicon wafers are the primary semiconductor substrates used to fabricate Integrated Circuits (ICs). Recently, the industry is making a transition from 200 to 300 mm wafers. To attain very flat 300 mm silicon wafers, grinding has been used to flatten the wire-sawn wafers. However, it is challenging for grinding to remove the waviness induced in wire sawing. To enhance the waviness removal ability of grinding process, several approaches have been explored including soft-pad grinding. This paperdoi:10.1504/ijmtm.2008.016769 fatcat:dbt2lmfl35bndeywr7buo4wzdq