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Fast Thermal Simulation using SystemC-AMS
2016
Proceedings of the 26th edition on Great Lakes Symposium on VLSI - GLSVLSI '16
Out of the many options available for thermal simulation of digital electronic systems, those based on solving an RC equivalent circuit of the thermal network are the most popular choice in the EDA community, as they provide a reasonable tradeoff between accuracy and complexity. HotSpot, in particular, has become the de-facto standard in these communities, although other simulators are also popular. These tools have many benefits, but they are relatively inefficient when performing thermal
doi:10.1145/2902961.2902975
dblp:conf/glvlsi/ChenVMP16
fatcat:2zn7xbgoqrcrvgblf6a737hy44