A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2020; you can also visit the original URL.
The file type is application/pdf
.
Role of Additives for Copper Damascene Electrodeposition
2004
Journal of the Electrochemical Society
The role of copper Damascene additives is discussed based on electrodeposit morphology on a through-mask cathode, field emission-Auger ͑FE-Auger͒, quartz crystal microbalance ͑QCM͒, and electrochemical measurements. Adsorbed particles, several tens of nanometers in diameter were observed on copper-electrodeposited surfaces by field emission-scanning electron microscopy ͑FE-SEM͒. These particles show a stronger oxygen intensity peak by FE-Auger spectrum than bare electrodeposited surfaces. The
doi:10.1149/1.1649235
fatcat:2lwo5a3farfoleyka2q4xch7gi