Characterization of copper nano structures prepared by DC sputtering on various substrates

Iman H. Hadi, Khaleel I. Hassoon, Muslim F. Jawad
2022 AIP Conference Proceedings  
Copper nanoparticles on FTO coated glass and Si (p-type) substrates by DC (direct current) sputtering technique have been prepared and investigated in this work. A disk of pure copper target has been used with Ar plasma climate inside the deposition chamber to obtain thinfilms with thicknesses of (120 and 260) nm at (1 and 8) min respectively. The structural and morphological form of Cu nanoparticles in function of different substrates at two different sputtering time has been studied. These
more » ... perties were investigated via field emission scanning electron microscopy (FESEM) and X-ray diffractometer (XRD). Scherrer's equation has been utilize to determine the grain size of the prepared thinfilms. Results from this study show that the thickness of the prepared thinfilms has been increased with increasing sputtering time for both substrates and the grain size at the same time has been changed from substrate to another.
doi:10.1063/5.0121142 fatcat:hfcn2qr5jfdthfnl53nyolirzq