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Characterization of copper nano structures prepared by DC sputtering on various substrates
AIP Conference Proceedings
Copper nanoparticles on FTO coated glass and Si (p-type) substrates by DC (direct current) sputtering technique have been prepared and investigated in this work. A disk of pure copper target has been used with Ar plasma climate inside the deposition chamber to obtain thinfilms with thicknesses of (120 and 260) nm at (1 and 8) min respectively. The structural and morphological form of Cu nanoparticles in function of different substrates at two different sputtering time has been studied. Thesedoi:10.1063/5.0121142 fatcat:hfcn2qr5jfdthfnl53nyolirzq