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Electrochemical impedance spectroscopy and cyclic voltammetry were used to characterize the aging of copper plating baths used in damascene process for superfilling of trenches and vias in the semiconductor industry. The effects of copper anode composition, anodic current density, and accelerator nature and concentration were studied. Phosphorus added to copper anodes has a prominent impact on the evolution of current/voltage curves and impedance spectra during bath aging. The observeddoi:10.1149/1.2357726 fatcat:jvc7xyjnkrfu5adhtfh7c3z7ta