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Cutting performance of diamond deposited WC-W2C sintered compacts for Al-20mass%Si alloy
過共晶Al‐20mass%Si合金に対するダイヤモンド被覆WC‐W2C焼結体の切削性能
1990
Keikinzoku/Journal of Japan Institute of Light Metals
過共晶Al‐20mass%Si合金に対するダイヤモンド被覆WC‐W2C焼結体の切削性能
Preserved Fulltext
Sintered WC-W2C compacts were used as the substrate for diamond deposition, because the compacts were expected to be a carbon sink during CVD to improve the adhesion strength between diamond film and substrate. The adhesion strength has been found to be improved, as expected, with increasing W2C content in the range up to about 50%. The diamond deposited WC-(6-22)% W2C tools show the most excellent cutting performance for hyper-eutectic Al-20mass% Si alloy. The effects of W2C in the substrate are in detail discussed.
doi:10.2464/jilm.40.606
fatcat:hxkbuihksncszjqzzl7p5aehoq