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Analytical Solution of the Non-Stationary Heat Conduction Problem in Thin-Walled Products during the Additive Manufacturing Process
2021
Materials
The work is devoted to the development of a model for calculating transient quasiperiodic temperature fields arising in the direct deposition process of thin walls with various configurations. The model allows calculating the temperature field, thermal cycles, temperature gradients, and the cooling rate in the wall during the direct deposition process at any time. The temperature field in the deposited wall is determined based on the analytical solution of the non-stationary heat conduction
doi:10.3390/ma14144049
doaj:642226cb4d1346b5a7ccc41d75b6d1ce
fatcat:3kqugds3inchnkoo753ucokjom