Two modes of surface roughening during plasma etching of silicon: Role of ionized etch products

Nobuya Nakazaki, Hirotaka Tsuda, Yoshinori Takao, Koji Eriguchi, Kouichi Ono
2014 Journal of Applied Physics  
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doi:10.1063/1.4903956 fatcat:by6c5mh3bnalfnmqv7qchcufcq