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Alignment technique using heterodyne interferometer in conjugate relation for wafer stepper
結像位置におけるヘテロダイン干渉を用いた位置検出法
1991
Journal of the Japan Society for Precision Engineering
結像位置におけるヘテロダイン干渉を用いた位置検出法
Preserved Fulltext
This paper describes an alignment technique applied to wafer stepper for sub-micron lithography. To obtain an alignment signal, a heterodyne interferometer is used . The detection plane is located at the conjugate position on the wafer surface to reduce an error caused by the tilt of wafer surface. Sensitibity of 8 nm is obtained stably with this system . In addition, a software
doi:10.2493/jjspe.57.262
fatcat:acsweg6gkrca7nyyankg4j6d5q