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Ultrafine grained (UFG) pure copper chips with improved material strength have been successfully prepared by large strain extrusion machining (LSEM). However, the thermal stability of the UFG chips has been a key characteristic that has restricted their use in practical applications. To understand the influence of annealing temperature and annealing time on their microstructures and mechanical properties, the UFG chips were subjected to isochronous and isothermal annealing treatments as well asdoi:10.3390/met8060381 fatcat:dat2djriufeg5h435ecfuwmnee