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Do, M. A. (2005). Accurate and scalable RF interconnect model for silicon-based RFIC applications. IEEE Transactions on Microwave Theory and Techniques, 53(9), 3035-3044. Date 2005 URL http://hdl.handle.net/10220/5338 Rights Abstract-A new figure of merit, intrinsic factor for interconnects, is proposed to provide insights as to how back-end metallization influences the performance of radio frequency integrated circuits. An accurate and scalable double-radio frequency interconnect model,doi:10.1109/tmtt.2005.854218 fatcat:idchwd4c5bd73dywb4v6uowwye