Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling

Soo Jung Hwang, Hyun Park, Je Hun Lee, Kyu Hwan Oh, Young Chang Joo
2002 Materials Science Forum  
The evolutions of surface morphologies in sputtered and electroplated Copper films during annealing were investigated. After annealing at 435 o C, in the electroplated Copper films grooves along the grain boundaries were observed, while in the sputtered films voids were observed at the triple junctions and along the grain boundaries. The textures and grain boundary characteristics of two films were analyzed. The densities of low energy boundaries were analyzed to explain the difference of the
more » ... difference of the surface morphologies.
doi:10.4028/www.scientific.net/msf.408-412.1651 fatcat:ijeiiyqs7zgsnguuvuqprnkz2i