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Over-Temperature Protection Circuit for GaN Devices Using a di/dt Sensor
2020
IEEE transactions on power electronics
Power semiconductor devices have maximum junction temperature limits, but it is not straightforward to sense or infer temperature inside sealed devices in running converters. One method is to observe electrical behavior that is known to be temperature dependent. For example, in some gallium nitride (GaN) power semiconductor devices, the maximum slope of the device current at turn-ON has been shown to reduce as the junction temperature increases. This article demonstrates the first noncontact
doi:10.1109/tpel.2020.3041594
fatcat:gptt3hqwybgejk5awzbtzryvfq